The HP-MK3 is a handheld blind-hole (hole-drilling) residual stress measurement system designed for fast, on-site evaluation of residual stress using micro-strain (με) signals. It combines an optical alignment module, a stable micro-drilling unit, and portable Win10 touch operation for efficient field work.
| Accurate Alignment | 160× optical microscope improves positioning reliability for repeatable measurements. |
|---|---|
| Low Drift Lighting | LED cold light source reduces temperature-related drift concerns during alignment. |
| Stable Drilling | integrated micro-drill with adjustable speed helps reduce positioning error and improves hole quality. |
| Works on Complex Geometry | supports flat, curved, and welded structures (corner/butt/fillet) for broader field use. |
| Field-Ready Workflow | handheld Win10 touchscreen operation with real-time stress curves and data storage. |
Optical alignment with LED cold light: built-in LED cold light source helps avoid temperature drift during alignment.
High-magnification measurement: optical alignment module uses a 160× tool microscope for precise positioning and reading.
Integrated micro electric drill: one-piece precision design with powered drive and adjustable speed for stable drilling and reduced positioning error.
Flexible drilling positions: supports drilling/measurement on flat surfaces, curved surfaces, corner welds, butt welds, and fillet weld areas.
Quick to operate: designed for convenient use and easy handling during residual stress measurement.
HP-MK3 is built for portable residual stress testing using the blind-hole method. The system focuses on three essentials for reliable field measurement:
Accurate alignment (160× microscope + LED cold light)
Stable micro drilling (reduced runout / wobble, adjustable speed)
Clear on-site data workflow (Win10 + 5″ touchscreen, real-time stress value/curve display, permanent storage)
Residual stress verification for welded structures (corner weld, butt weld, fillet weld zones)
Manufacturing process validation (machining / forming / joining induced stress)
Quality inspection and process troubleshooting for metal components
On-site residual stress checks for flat plates, curved parts, and complex surfaces
Micro-strain (με) input for residual stress testing workflows
3 input channels, suitable for multi-channel strain measurement during blind-hole testing
Real-time display of stress values and stress curves on the handheld interface
Input Channels: 3 channels
Sampling Rate: 10 Hz / channel
Input Range: ±30000 με
Resolution: 0.1 με
Measurement Error: ≤ ±0.1%
Calculation Precision: 1 MPa
Stress Error: ≤ 10 MPa
Blind-Hole Size: Φ1.0 mm
Drilling Depth Control Pad: 2.0 mm (preset hole depth 2.0 mm)
Data Processing / Operation: Win10 OS, handheld 5-inch touchscreen, real-time stress value & curve display, permanent data storage
1) What method does HP-MK3 use for residual stress testing?
It is designed for blind-hole (hole-drilling) residual stress measurement, using micro-strain (με) signal acquisition and stress calculation.
2) Can it measure on curved surfaces or welded areas?
Yes. It supports flexible drilling on flat surfaces, curved surfaces, corner welds, butt welds, and fillet weld areas.
3) What helps improve alignment accuracy in the field?
The system includes an optical alignment module with 160× tool microscope and an LED cold light source for stable observation.
4) What’s the standard hole size and depth setup?
Blind-hole size is Φ1.0 mm, and the depth control pad is 2.0 mm (preset hole depth 2.0 mm).
5) How is data displayed and stored?
A handheld Win10 + 5″ touchscreen displays real-time stress values and curves, and supports permanent data storage.